On the usefulness of additional vias in multilayer printed wiring boardsGHAMESHLU, M; YOSHIDA, N.Transactions of the Institute of Electronics and Communication Engineers of Japan. Section E. 1988, Vol 71, Num 11, pp 1091-1094, issn 0387-236XArticle

How to remove pin gate arrays from PCB'sMACDONALD, T. M.Electronic manufacturing. 1989, Vol 35, Num 2, pp 14-16, 3 p.Article

Focus on circuit board rework and repairBAUSELL, J.Electronic manufacturing. 1989, Vol 35, Num 2, pp 11-13, 3 p.Article

How to implement PWB engineering change orders with a wireless, dry PTF processDESMARAIS, R. C.Electri.onics. 1987, Vol 33, Num 7, pp 35-36, issn 0745-4309Article

Comparison of current solder masking technologiesFRAULA, D.Electri.onics. 1986, Vol 32, Num 11, pp 11-14, issn 0745-4309Article

Wirability of knock-knee layouts with 45° wiresCHIANG, C; MAJID SARRAFZADEH.IEEE transactions on circuits and systems. 1991, Vol 38, Num 6, pp 613-624, issn 0098-4094, 12 p.Article

Trends in PWB laminate performanceKUSH, D.Electri.onics. 1987, Vol 33, Num 9, pp 33-34, issn 0745-4309Article

Differential scanning calorimetry of prepregs for multilayer printed circuits boardsKRETZSCHMAR, K; HOFFMANN, K. W; FISCHER, L et al.Siemens Forschungs- und Entwicklungsberichte. 1987, Vol 16, Num 3, pp 101-104, issn 0370-9736Article

Oxide selection tips for multilayer PWB fabricationNARGI, K.Electri.onics. 1987, Vol 33, Num 4, pp 19-20, issn 0745-4309Article

Il collaudo di circuiti su piastra stawpata = Le test des circuits sur plaque imprimée = The Printed-card-board circuit testFRANCESE, F.Alta frequenza. 1988, Vol 57, Num 6, pp 177-187, issn 0002-6557Article

Effects of process variables on dry-film solder mask tentsVARNELL, D. F.Electronic manufacturing. 1989, Vol 35, Num 4, pp 28-31, 4 p.Article

Requirements for PCB small-hole drilling machinesWILE, D.Electronic manufacturing. 1989, Vol 35, Num 4, pp 12-14, 3 p.Article

The causes and prevention of electrostatic discharge damage to circuit devicesDUMAY, P.Electronic manufacturing. 1989, Vol 35, Num 4, pp 18-20, 3 p.Article

New production technologies for PCBs in the 90'sMESSNER, G.Alta frequenza. 1988, Vol 57, Num 1, pp 3-14, issn 0002-6557Article

Surface analysis and characterization of large printed-circuit-board circuitization process stepsAUERBACH, D. J; BRUNDLE, C. R; MILLER, D. C et al.IBM journal of research and development. 1988, Vol 32, Num 5, pp 669-681, issn 0018-8646Article

Bridging the Interconnection Density Gap for Exascale ComputationSTEVENSON, Daniel S; CONN, Robert O.Computer (Long Beach, CA). 2011, Vol 44, Num 1, pp 49-57, issn 0018-9162, 9 p.Article

Automatic PCB testing using microcomputer-based systemsFORRESTER, S; BUTLER, B.Electronic manufacturing. 1989, Vol 35, Num 4, pp 22-24, 3 p.Article

Solving static electricity problems in the manufacturing environmentROSS, B.Electronic manufacturing. 1989, Vol 35, Num 4, pp 15-16, 2 p.Article

Matching application requirements and materials used for labelsLYON, M.Electronic manufacturing. 1988, Vol 34, Num 6, pp 23-26Article

Electrical design of signal lines for multilayer printed circuit boardsCHANG, C. S.IBM journal of research and development. 1988, Vol 32, Num 5, pp 647-657, issn 0018-8646Article

Recovering copper from PCB plating rinsewaters: ion exchange technology for recycling a valuable commodity alsa yields reduced operating expensesWRIGHT, J; NELIS, P. M; KRAMBEER, C et al.Electronic manufacturing. 1989, Vol 35, Num 1, pp 9-11, 3 p.Article

X-ray inspection of three-dimensional solder jointsBAKER, B.Electronic manufacturing. 1989, Vol 35, Num 2, pp 20-22, 3 p.Article

D.P.S. 500: la métallisation des C.I sans cuivre chimique. Un nouveau concept de fabrication qui, déjà, a fait ses preuves = D.P.S. 500: metallization of printed circuits without electroless copper. A new fabrication conceptIBORRA, M.-F.Galvano organo. Le professionnel des traitements de surface. 1993, Vol 62, Num 639, pp 921-923Article

How to evaluate CAE equipment for PWB layout. IIMILLER, T. C.Electri.onics. 1987, Vol 33, Num 14, issn 0745-4309, 51Article

Choices in standard and custom busing for multilayer backplanesSTERANKO, J.Electri.onics. 1986, Vol 32, Num 13, pp 50-53, issn 0745-4309Article